• A process utilized for the definition of a pattern on the surface of a semiconductor wafer. In it, the wafer is first covered with a resist which is utilized to produce the desired pattern. A metal, such as gold, is then applied onto the resist and substrate. The resist is then dissolved, in the process lifting-off the metal on it, so that only the desired pattern remains on the substrate. Used, for instance, in cases where etching is difficult or otherwise inadvisable. Also spelled liftoff.

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